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SMD Solder Paste Sn63/Pb37 Type 4 No-Clean For Precision SMT & PCB Repair 100g/250g/500g
SKU
MD-02329
PKR 3,500.00
Premium Sn63/Pb37 Type 4 No-Clean Solder Paste designed for high-precision SMT, BGA, and ultra-fine pitch PCB repair.
⚡ Real-Time Stock:
7 Units
✔ In Stock & Ready to Ship
Categories: Soldering Stations, Others, SMT Consumable
Maximize your surface mount technology (SMT) efficiency with our premium Sn63/Pb37 Type 4 Solder Paste. Formulated with an optimal 63% Tin and 37% Lead alloy, this eutectic solder creates reliable, high-strength electrical joints with a consistent, single melting point of 183°C. The T4 fine particle size (20–38µm) guarantees exceptional print definition, making it ideal for ultra-fine pitch stencils and micro-component soldering. Featuring a no-clean, halide-free flux formulation, this paste leaves behind non-corrosive, non-conductive residue—eliminating the need for post-solder cleaning.
Key Features:
- Alloy Composition: Sn63/Pb37 (63% Tin / 37% Lead)
- Particle Size: Type 4 (20–38 µm), perfect for ultra-fine pitch (down to 0.3mm)
- Melting Point: Eutectic at exactly 183°C
- Flux Type: No-Clean, ROL0/ROL1, halogen-free
- Excellent Wettability: Ensures strong, shiny, and reliable solder joints
Recommended Reflow Profile Parameters
- Preheat Zone (Ramp-up): Target a rate of 1.0°C to 3.0°C per second up to 150°C. This safely evaporates volatile solvents without causing solder spattering.
- Soak Zone: Maintain the temperature between 150°C and 180°C for 60 to 120 seconds. This activates the "no-clean" flux to remove oxides and ensures uniform thermal distribution across the PCB components.
- Reflow Zone (Liquidous): The temperature must exceed the melting point of 183°C for 30 to 60 seconds (time above liquidous).
- Peak Temperature: The ideal peak temperature should reach 210°C to 230°C. Do not exceed 240°C to prevent damage to sensitive components.
- Cooling Zone: Cool the assembly down at a rate of 3.0°C to 6.0°C per second. Rapid cooling ensures a fine grain structure, resulting in bright, mechanically strong, and shiny solder joints
| Part Number | Sn63Pb37-T4 |
|---|---|
| Manufacturer | NA / Unknown |
| Weight (KG) | 0.100000 |
| Material | NA |
| Packing Unit | 1 Piece |
| Product Availability | In Stock |
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