Layer count

1-20 Layers

The number of copper layers in the board.

Controlled Impedance

4/6 layer, default layer stack-up

Material

FR-4

Aluminum

Copper core

Rogers / PTFE Teflon

FR-4: Tg 135 / Tg140 / Tg155 / Tg170

Aluminum thermal conductivity: 1W/m.K

Copper core thermal conductivity: 380W/m.K

Dielectric constant

4.5(double-sided PCB)

7628 Prepreg 4.6

3313 Prepreg 4.05

2116 Prepreg 4.25

Max. Dimension

400x500mm

The maximum dimension we can accept

Dimension Tolerance

±0.1mm

±0.1mm(Precision) and ±0.2mm(Regular) for CNC routing, and ±0.4mm for V-scoring

Board Thickness

0.4 - 2.5 mm

Thickness for FR4 are: 0.4/0.6/0.8/1.0/1.2/2.0 mm (2.5 mm only available with 12 layers or more. )

Thickness Tolerance

( Thickness≥1.0mm)

± 10%

e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%)

Thickness Tolerance

( Thickness<1.0mm)

± 0.1mm

e.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1).

Finished Outer Layer Copper

1 oz / 2 oz (35um / 70um)

Finished copper weight of outer layer is 1oz or 2oz.

Finished Inner Layer Copper

0.5 oz / 1 oz / 2 oz (17.5um / 35um / 70um)

Finished copper weight of inner layer is 0.5oz by default.

Surface Finish

HASL (leaded / lead-free), ENIG, OSP (copper core boards only)

FR4 has all three finishes available, 6+ layers and RF boards only have ENIG.

Aluminium core boards only have HASL. Copper core boards only have OSP.

Drill Hole Size

0.15mm - 6.30mm

1 & 2 Layer PCB: 0.3 - 6.3mm

Multi-Layer PCB: 0.15 - 6.3mm (0.15mm more costly)

Drill Hole Size Tolerance

+0.13/-0.08mm

e.g. for the 0.6mm hole size, the finished hole size between 0.52mm to 0.73mm is acceptable.

Blind/Buried Vias

Don’t support

Currently we don't support Blind/Buried Vias, only make through holes.

Min. Via hole size/diameter

0.15mm / 0.25mm

- 1 & 2 Layer PCB: 0.3mm(hole size) / 0.5mm(diameter)

- Multi-Layer PCB: 0.15mm(Via hole size) / 0.25mm(Via diameter)

① Via diameter should be 0.1mm(0.15mm preferred) larger than Via hole size

② Preferred Min. Via hole size: 0.2mm

PTH hole Size

0.20mm - 6.35mm

The annular ring size will be enlarged to 0.15mm in production.

Pad Size

Minimum 1.0mm

The pad size will be enlarged by 0.5mm than the hole size. The minimum size of annular ring around plated through hole pads is 0.25mm. If the recommended sizes are not respected then the pad will not be produced properly.

Min. Non-plated holes

0.50mm

The minimum NPTH dimension is 0.50mm, Please add the NPTH in the mechanical layer or keep out layer.

NPTH

0.2mm

We make NPTH via dry sealing film process, if customer would like a NPTH but around with pad/copper, our engineer will dig out around pad/copper about 0.2mm-0.25mm, otherwise the metal potion will be flowed into the hole and it becomes a PTH. (there will be no copper dig out optimization for single board).

Min. Plated Slots

0.5mm

The minimum plated slot width is 0.5mm, which is drawn with a pad.

Min. Non-Plated Slots

1.0mm

The minimum Non-Plated Slot Width is 1.0mm, please draw the slot outline in the mechanical layer(GML or GKO)

Min. Castellated Holes

0.60mm

A castellated pad includes a plated half-hole on the edge of a board, usually used on daughter PCB modules to solder to carrier boards.

① Hole diameter ≥ 0.6 mm

② Hole to board edge ≥ 1 mm

③ Min. board size 10 × 10 mm

Hole size Tolerance (Plated)

+0.13mm/-0.08mm

e.g. for the 1.00mm Plated hole, the finished hole size between 0.92mm to 1.13mm is acceptable.

Hole size Tolerance (Non-Plated)

±0.2mm

e.g. for the 1.00mm Non-Plated hole, the finished hole size between 0.80mm to 1.20mm is acceptable.

Rectangle Hole/Slot

Don’t support

Rectangle/Square Slots, we don't make rectangular or square plated holes,only make oval or round plated slots.

For non-plated slots, rounded corner-rectangular or square slots are supported. The recommended minimum size is 3x3mm.

1oz Copper

0.13mm

0.3mm

2oz Copper

0.2mm

0.3mm

Hole to hole clearance(Different nets)

0.5mm

Via to Via clearance(Same nets)

0.254mm

Pad to Pad clearance(Pad without hole, Different nets)

0.127mm

Pad to Pad clearance(Pad with hole, Different nets)

0.5mm

Via to Track

0.254mm

PTH to Track

0.33mm

NPTH to Track

0.254mm

Pad to Track

0.2mm

1-2 Layers

5mil (0.127mm)

5mil (0.127mm)

4-6 Layers

3.5mil (0.09mm)

3.5mil (0.09mm)

2oz Copper weight

8mil (0.2mm)

8mil (0.2mm)

1/2 layers

0.25 mm

0.127mm

4/6 layers

0.25 mm

0.127mm

Soldermask Expansion

0.038mm

2 layer: Expansion ≥ 0.038 mm each side; Edge of opening to adjacent traces ≥ 0.05 mm.

Multilayer: No expansion required

Min. Solder bridge

0.10mm

2 layers: 0.10 mm regular, 0.08 mm minimum (0.13 mm with black or white soldermask).

Multilayer: 0.08 mm (0.13 mm with black or white soldermask). Soldermask webs are possible between pads at least 4 mil apart.

Via Covering

Epoxy Filled & Capped

Copper paste Filled&Capped

Via hole size: 0.2 to 0.5 mm

Annular ring: 0.05 mm minimum, 0.075 mm preferred

The via-in-pad must be placed more than 1.0 mm from regular PTHs or NPTHs

Learn more>

Solder mask color

green, red, yellow, blue, white, and black.

We use LPI (Liquid Photo Imageable) solder mask. It is the most common type of mask used today.

Solder mask dielectric constant

3.8

Solder mask ink thickness

10-15UM

Minimum Line Width

6 mil (0.153mm)

Characters width less than 6mil(0.153mm) will be unidentifiable.

Minimum text height

40 mil (1.0mm)

Characters height less than 40 mil(1.0mm) will be unidentifiable.

Character width to height ratio

1:6

The preferred ratio of width to height is 1:6.

Hollow-carved Character width to height ratio

1:6

The preferred ratio of width to height is 1:6

Pad To Silkscreen

0.15mm

The Minimum Distance Between Pad and Silkscreen is 0.15mm.

Trace to Outline(Routed)

0.3 mm

① Copper to board edge ≥ 0.3 mm

② Copper to milled slot ≥ 0.3 mm

③ Routed outline tolerance: ± 0.2 mm (regular), ± 0.1 mm (precision)

Trace to V-cut line(V-Cut Panel)

0.4 mm

① Copper to V-cut line ≥ 0.4 mm

② V-cut outline tolerance ± 0.4 mm (board thickness ≥ 0.6 mm）

③ Zero spacing between sub-boards by default. If using V-cuts on two opposing edges only, 1.6 or 2.0 mm spacing can be used on the other edges.

Mouse Bites Panel

0.3 mm

① Copper to routed parts of edges ≥ 0.3 mm

② Routed outline tolerance: ± 0.2 mm (regular), ± 0.1 mm (precision)

③ 1.6 or 2.0mm spacing between sub-boards by default.

④ Stamp-like edges will remain after separation

⑤ Minimum edge rail is 3mm in width. For PCB assembly, use 5mm edge rails, 1mm fiducials placed, 2mm tooling holes, 3.85mm from fiducial to board edge.